Analyze the layout of the diamond cutter tool industry, pay attention to the rigidity, wear resistance, and durability of high-speed steel, hard alloys, diamond saw blades, and serrations during drilling and dressing, and coordinate and evenly utilize their performance to achieve a higher level of advanced mechanical practicality and stability.
The application of diamond grinding wheels is very extensive, and grinding is carried out on high grinding capacity shoulder blades with relatively high and sharp edges, thereby increasing the sharpness and durability of the workpiece being processed.
Diamond grinding wheels have a lot to talk about in terms of structure, and customers will carefully consider them. From a long-term perspective, there are innovative solutions. In order to facilitate employees in improving their product quality, the following is the selection of Bike.
Our company believes that impurities on the surface of silicon wafers must be removed before polishing, and the silicon wafers must also be decontaminated and cleaned. When disposing of the silicon wafers, thorough cleaning is necessary. After our company's review, the customer's predecessor has been installed with dust spray. Once the dust spray is released, the dust wave should always be at a high temperature of 300 ° C. Silicon wafer polishing machines are also widely used in glass polishing paste as a good choice for polishing sand. It is precisely because of this that the quality of polishing technology services determines that regardless of the quality of silicon wafer polishing paste, customers should be the first to identify it. Below is a brief introduction to the dust collection of silicon wafer polishing paste.
How to select the polished diamond silicon wafers after polishing? The method of electrolytic polishing. There are many methods for electrolytic polishing, which can also be used to make grinding wheels, modules, parts, etc. If you want to purchase silicon wafer polishing paste, it is better to use empty silicon silicate target material. However, there is still a significant difference in the combination of quality between the two, and if one chooses acid based silicon wafer polishing paste, there can still be a great cost-effectiveness.
If we want to choose a silicon wafer polishing paste with a coarser roughness, it is recommended to use the upper and lower parts with sharp edges, and the polishing pressure is often small to the polishing size, resulting in a good surface finish. This way, the polishing resistance is small, the service life is also short, and the bevel angle smoothness is good. Also known as cutting, it is relatively warm, especially the most widely used polishing paste for silicon wafers today is thin semiconductor materials< eod>。
